ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,749, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor packages" was invented by Wei-Yu Chen (New Taipei, Taiwan), An-Jhih Su (Taoyuan, Taiwan), Der-Chyang Yeh (Hsinchu, Taiwan), Li-Hsien Huang (Zhubei, Taiwan) and Ming Shih Yeh (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: an integrated circuit die; a first dielectric layer over the integrated circuit die; a first metallization pattern extending through the first dielectric layer to electrically connect to the integrated circuit die; a second dielectric layer over the first metallizati...