US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Semiconductor package and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,801, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method for manufacturing the same" was invented by Po-Han Wang (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Shih-Peng Tai (Hsinchu County, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and I-Chia Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a plurality of semiconductor devices, an insulating layer, and a redistribution layer is provided. The insulating layer is disposed over the semiconductor device. The redistribution layer is disposed over the insulating layer and ...