US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 1 for "Semiconductor devices with backside power rail and methods of fabrication thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,775, issued on July 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor devices with backside power rail and methods of fabrication thereof" was invented by Lo-Heng Chang (Hsinchu, Taiwan), Kuo-Cheng Chiang (Hsinchu County, Taiwan), Zhi-Chang Lin (Hsinchu, Taiwan), Jung-Hung Chang (Changhua County, Taiwan), Shih-Cheng Chen (New Taipei, Taiwan), Shi-Ning Ju (Hsinchu, Taiwan) and Chih-Hao Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Corner portions of a semiconductor fin are kept on the device while removing a semiconductor fin prior to forming a backside contact. The corner porti...