US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Semiconductor devices and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,379, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacture" was invented by Zhi-Chang Lin (Zhubei, Taiwan), Shih-Cheng Chen (New Taipei, Taiwan), Lo-Heng Chang (Hsinchu, Taiwan), Jung-Hung Chang (Yuanlin, Taiwan) and Kuo-Cheng Chiang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices using a dielectric structure and methods of manufacturing are described herein. The semiconductor devices are directed towards gate-all-around (GAA) devices that are formed over a substrate and are isolated from one another by the dielectric stru...