US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Semiconductor device structure with a protection cap at an end portion of a conductive line" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,722, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device structure with a protection cap at an end portion of a conductive line" was invented by Ting-Li Yang (Tainan, Taiwan), Wei-Li Huang (Pingtung, Taiwan), Sheng-Pin Yang (Kaohsiung, Taiwan), Chi-Cheng Chen (Tainan, Taiwan), Hon-Lin Huang (Hsinchu, Taiwan), Chin-Yu Ku (Hsinchu, Taiwan) and Chen-Shien Chen (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure i...