US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 1 for "Semiconductor device package having warpage control" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,817, issued on July 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device package having warpage control" was invented by Heh-Chang Huang (Hsinchu, Taiwan), Fu-Jen Li (Hsinchu, Taiwan), Pei-Haw Tsao (Tai-chung, Taiwan) and Shyue-Ter Leu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a package substrate having a first surface and a second surface opposite to the first surface. Several integrated devices are bonded to the first surface of the package substrate. A f...