US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 1 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,382, issued on July 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Cheng-Yi Peng (Taipei, Taiwan), Chih Chieh Yeh (Taipei, Taiwan), Chih-Sheng Chang (Hsinchu, Taiwan), Hung-Li Chiang (Taipei, Taiwan), Hung-Ming Chen (Zhubei, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a fin structure disposed over a substrate; a gate structure disposed over part of the fin structure; a source/drain structure, which includes part of the fin structure not covered by the gate structur...