ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,769, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Resistor within a via" was invented by Chi-Han Yang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some implementations, one or more semiconductor processing tools may form a via for a semiconductor device. The one or more semiconductor processing tools may deposit a metal plug within the via. The one or more semiconductor processing tools may deposit an oxide-based layer on the metal plug within the via. The one or more semiconductor processing tools may deposit a resistor on the oxide-based layer within the via. The one or more...