US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Probe card substrate, substrate structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,740, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Probe card substrate, substrate structure and method of fabricating the same" was invented by Wei-Yu Chen (Hsinchu, Taiwan), Yu-Min Liang (Taoyuan, Taiwan), Hao-Cheng Hou (Hsinchu, Taiwan), Tsung-Ding Wang (Tainan, Taiwan), Chien-Hsun Lee (Hsin-chu County, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Jung-Wei Cheng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure includes a core substrate, a redistribution layer, a plurality of test pads, a first protective coating, at least one conductive pad and a passive devic...