ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,739, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Chih-Wei Wu (Yilan County, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan) and Wen-Chih Chiou (Miaoli County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a semiconductor die, a redistribution circuit structure, a backside dielectric layer, conductive terminals, an electronic device, and an underfill is provided. The semiconductor die laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating e...