US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 1 for "Package component" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,268, issued on July 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package component" was invented by Chun-Wei Chang (Taoyuan County, Taiwan), Jian-Hong Lin (Yunlin, Taiwan), Shu-Yuan Ku (New Taipei, Taiwan), Wei-Cheng Liu (Hsinchu County, Taiwan), Yinlung Lu (Hsinchu, Taiwan) and Jun He (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package component includes a first substrate and a first conductive layer. The first substrate has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed over the first surface of the first substrate. The...