US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Organic interposer including intra-die structural reinforcement structures and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,764, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Organic interposer including intra-die structural reinforcement structures and methods of forming the same" was invented by Li-Ling Liao (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Chia-Kuei Hsu (Hsinchu, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An organic interposer includes dielectric material layers embedding redistribution interconnect structures, package-side bump structures located on a first side of the diele...