US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Laser de-bonding carriers and composite carriers thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,696, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Laser de-bonding carriers and composite carriers thereof" was invented by Huicheng Chang (Tainan, Taiwan), Jyh-Cherng Sheu (Hsinchu, Taiwan), Chen-Fong Tsai (Hsinchu, Taiwan), Yun Chen Teng (New Taipei, Taiwan), Han-De Chen (Hsinchu, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a package component to a composite carrier. The composite carrier includes a base carrier and an absorption layer, and the absorption layer is between the base carrier and the package component. A laser bea...