ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,395, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Inter block for recessed contacts and methods forming same" was invented by Te-Chih Hsiung (Taipei, Taiwan), Jyun-De Wu (Hsinchu, Taiwan), Yi-Chen Wang (Hsinchu, Taiwan), Yi-Chun Chang (Hsinchu, Taiwan) and Yuan-Tien Tu (Puzih, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments provide a dielectric inter block disposed in a metallic region of a conductive line or source/drain contact. A first and second conductive structure over the metallic region may extend into the metallic region on either side of the inter block. The inter block ...