US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Integrated chip with graphene based interconnect" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,776, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip with graphene based interconnect" was invented by Shin-Yi Yang (New Taipei, Taiwan), Meng-Pei Lu (Hsinchu, Taiwan), Chin-Lung Chung (Taoyuan, Taiwan), Ming-Han Lee (Taipei, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an integrated chip. The integrated chip includes a substrate. A first conductive feature is over the substrate. A second conductive feature is over the substrate and is adjacent to the first conductive feature. The first and second conductive...