US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 1 for "In-situ defect count detection in post chemical mechanical polishing" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,735, issued on July 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"In-situ defect count detection in post chemical mechanical polishing" was invented by Chun-Hung Liao (Taichung, Taiwan), Jeng-Chi Lin (Hsinchu, Taiwan), Chi-Jen Liu (Taipei, Taiwan), Liang-Guang Chen (Hsinchu, Taiwan) and Huang-Lin Chao (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In-situ defect count detection in post chemical mechanical polishing (post-CMP) is provided. Post-CMP is performed, in-situ and according to a recipe, on a surface of a semiconductor wafer within a post-CMP chamber. A light signal is scanned over a ...