US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Die corner removal for underfill crack suppression in semiconductor die packaging" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,802, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Die corner removal for underfill crack suppression in semiconductor die packaging" was invented by Wei-Yu Chen (Hsinchu, Taiwan), Chi-Yang Yu (Zhongli, Taiwan), Kuan-Lin Ho (Hsinchu, Taiwan), Chin-Liang Chen (Kaohsiung, Taiwan), Yu-Min Liang (Zhongli, Taiwan) and Jiun Yi Wu (Zhongli, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure includes a fan-out package containing at least one semiconductor die, an epoxy molding compound (EMC) die frame laterally surrounding the at least one semiconductor die, and a redistribution ...