US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Debonding structures for wafer bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,717, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Debonding structures for wafer bonding" was invented by Wei-Ting Yeh (Hsinchu, Taiwan), Zheng Yong Liang (Hsinchu, Taiwan), De-Yang Chiou (Hsinchu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan) and Keng-Chu Lin (Ping-Tung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a method to form a bonded semiconductor structure. The method includes forming a first bonding layer on a first wafer, forming a debonding structure on a second wafer, forming a second bonding layer on the debonding structure, bonding the first and sec...