US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Bond pad structure coupled to multiple interconnect conductive structures through trench in substrate" (Taiwanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,799, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bond pad structure coupled to multiple interconnect conductive structures through trench in substrate" was invented by Ming Chyi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to a device that includes an interconnect structure arranged on a frontside of a substrate. The interconnect structure includes interconnect conductive structures embedded within interconnect dielectric layers. A trench extends completely through the substrate to expose multiples ones of the interconnect ...