US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 28 for "Semiconductor wafer testing system and related method for improving external magnetic field wafer testing" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,210,055, issued on Jan. 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor wafer testing system and related method for improving external magnetic field wafer testing" was invented by Harry-Hak-Lay Chuang (Zhubei, Taiwan), Chih-Yang Chang (Hsinchu, Taiwan), Ching-Huang Wang (Pingjhen, Taiwan), Tien-Wei Chiang (Taipei, Taiwan), Meng-Chun Shih (Hsinchu, Taiwan) and Chia Yu Wang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or mo...