US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 28 for "Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,823, issued on Jan. 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Ching-Jung Yang (Taoyuan, Taiwan), Ming-Fa Chen (Taichung, Taiwan), Sung-Feng Yeh (Taipei, Taiwan) and Ying-Ju Chen (Yunlin County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes first and second dies, an insulation structure, a through via, a dielectric layer and a redistribution layer. The second die electrically bonded to the first die includes a thr...