US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 28 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,210,188, issued on Jan. 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Hung-Yi Kuo (Taipei, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Cheng-Chieh Hsieh (Tainan, Taiwan), Che-Hsiang Hsu (Taichung, Taiwan), Chung-Ming Weng (Taichung, Taiwan) and Tsung-Yuan Yu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack stru...