US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 28 for "Integrated circuit package and method of forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,707, issued on Jan. 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Integrated circuit package and method of forming thereof" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Ying-Ju Chen (Tuku Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an integrated circuit package includes attaching a first die to an interposer. The interposer includes a first die connector and a second die connector on the interposer and a first dielectric layer covering at least one sidewall of the first die connector and at least one sidewall of the second die conne...