US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 28 for "Conductive rail structure for semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,790, issued on Jan. 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Conductive rail structure for semiconductor devices" was invented by Yi-Bo Liao (Hsinchu, Taiwan), Wei Ju Lee (Hsinchu, Taiwan), Cheng-Ting Chung (Hsinchu, Taiwan), Hou-Yu Chen (Zhubei, Taiwan), Chun-Fu Cheng (Zhubei, Taiwan) and Kuan-Lun Cheng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a first vertical structure and a second vertical structure formed over the substrate, and a condu...