US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 28 for "Arched membrane structure for MEMS device" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,209,013, issued on Jan. 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Arched membrane structure for MEMS device" was invented by Jhao-Yi Wang (Tainan, Taiwan), Chin-Yu Ku (Hsinchu, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan), Lung-Kai Mao (Kaohsiung, Taiwan) and Ming-Da Cheng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a supporting substrate to a semiconductor substrate of a wafer. A bonding layer is between, and is bonded to both of, the supporting substrate and the semiconductor substrate. A first etching process is performed to etch the supporting substrate and to form an...