US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Systems and methods for modeling via defect" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,357, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Systems and methods for modeling via defect" was invented by Cheng-Yi Lin (Hsinchu, Taiwan), Tsung-Yang Hung (Zhubei, Taiwan), Ankita Patidar (San Jose, Calif.), Ming-Yih Wang (Hsinchu, Taiwan) and Sandeep Kumar Goel (Dublin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes acquiring a design layout of a standard cell, extracting feature information of one or more vias in the standard cell from the design layout, performing a circuit simulation to obtain first simulation outputs of the standard cell for input patterns by app...