US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Simplified carrier removable by reduced number of CMP processes" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,766, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Simplified carrier removable by reduced number of CMP processes" was invented by Chun-Wei Chang (Hsinchu, Taiwan), Ming-Fa Chen (Taichung, Taiwan), Chao-Wen Shih (Zhubei, Taiwan) and Ting-Chu Ko (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first package component on a composite carrier, and performing a first polishing process on the composite carrier to remove a base carrier of the composite carrier. The first polishing process stops on a first layer of the composite carrier. A second polishing proce...