ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,827, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor structure" was invented by Mao-Yen Chang (Kaohsiung, Taiwan), Yu-Chia Lai (Miaoli County, Taiwan), Cheng-Shiuan Wong (Hsinchu, Taiwan), Ting Hao Kuo (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan) and Hsiu-Jen Lin (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a functional die, a dummy die, a conductive feature, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die....