US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 27 for "Semiconductor packages and methods of forming" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,559, issued on Jan. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Semiconductor packages and methods of forming" was invented by Cheng-Chieh Li (Hsinchu, Taiwan), Chih-Wei Wu (Zhuangwei Township, Taiwan) and Ying-Ching Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor structure includes: forming a first redistribution structure on a first side of a wafer, the first redistribution structure including dielectric layers and conductive features in the dielectric layers; forming grooves in the first redistribution structure, the grooves exposing sidewalls of the ...