US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Semiconductor package including semiconductor dies having different lattice directions and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,850, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including semiconductor dies having different lattice directions and method of forming the same" was invented by Jen-Yuan Chang (Hsinchu, Taiwan) and Chia-Ping Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die stack includes a first semiconductor die having a first lattice direction, and a second semiconductor die bonded to the first semiconductor die and having a second lattice direction different than the first lattice direction."

The patent was filed on Aug. 8, 2023, under Application...