US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,836, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming same" was invented by Kuan-Hung Chen (Hsinchu, Taiwan), Hong-Seng Shue (Zhubei, Taiwan), Po-Hao Tsai (Taoyuan, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a plurality of dielectric layers, forming a lower portion of a seal ring including a plurality of metal layers, each extending into one of the plurality of dielectric layers, depositing a first passivation layer over the pl...