US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 27 for "Post CMP cleaning apparatus and post CMP cleaning methods" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,739, issued on Jan. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Post CMP cleaning apparatus and post CMP cleaning methods" was invented by Chen-Hao Wu (Hsinchu, Taiwan), Chu-An Lee (Hsinchu, Taiwan), Chun-Hung Liao (Taichung, Taiwan), Shen-Nan Lee (Jhudong Township, Hsinchu County, Taiwan), Teng-Chun Tsai (Hsinchu, Taiwan), Huang-Lin Chao (Hillsboro, Ore.) and Chih-Hung Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A post CMP cleaning apparatus is provided. The post CMP cleaning apparatus includes a cleaning stage. The post CMP cleaning apparatus also includes a rotating platen disposed ...