US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Package structure having line connected via portions" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,816, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure having line connected via portions" was invented by Chih-Kai Cheng (Hsinchu County, Taiwan), Tsung-Shu Lin (New Taipei, Taiwan), Tsung-Yu Chen (Hsinchu, Taiwan), Hsien-Pin Hu (Zhubei, Taiwan) and Wen-Hsin Wei (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and method for forming the same are provided. The package structure includes a substrate having a front surface and a back surface, and a die formed on the back surface of the substrate. The package structure includes a first through via stru...