US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 27 for "Methods for selectively removing material" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,776, issued on Jan. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods for selectively removing material" was invented by Yi-Hsiang Chao (Taipei, Taiwan), Shu-Lan Chang (Hsinchu, Taiwan), Ching-Yi Chen (Hsinchu, Taiwan), Shih-Wei Yeh (Hsinchu, Taiwan), Pei Shan Chang (Taipei, Taiwan), Ya-Yi Cheng (Taichung, Taiwan), Yu-Chen Ko (Chiayi, Taiwan), Yu-Shiuan Wang (Taipei, Taiwan), Chun-Hsien Huang (Hsinchu, Taiwan), Hung-Chang Hsu (Kaohsiung, Taiwan), Chih-Wei Chang (Hsin-Chu, Taiwan), Ming-Hsing Tsai (Chu-Pei, Taiwan) and Wei-Jung Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided i...