US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Method for forming a hard mask with a tapered profile" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,711, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for forming a hard mask with a tapered profile" was invented by Min-Yung Ko (Hsinchu, Taiwan), Chern-Yow Hsu (Chu-Bei, Taiwan), Chang-Ming Wu (New Taipei, Taiwan) and Shih-Chang Liu (Alian Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a method for forming a memory cell. In some embodiments, a memory film is deposited over a substrate and comprises a bottom electrode layer, a top electrode layer, and a data storage film between the top and bottom electrode l...