US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Memory packages and methods of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,851, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Memory packages and methods of forming same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chung-Hao Tsai (Huatan Township, Taiwan), Chuei-Tang Wang (Taichung, Taiwan) and Yih Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a memory stack attached to a logic device, the memory stack including first memory structures, a first redistribution layer over and electrically connected to the first memory structures, second memory structures on the first redistribution layer, a second redistribution layer over and e...