US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 27 for "Integrated chip package including a crack-resistant lid structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,835, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip package including a crack-resistant lid structure and methods of forming the same" was invented by Wensen Hung (Zhubei, Taiwan), Tsung-Yu Chen (Hsinchu, Taiwan), Hsuan-Ning Shih (Taoyuan, Taiwan) and Wen-Hsin Wei (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure includes an assembly containing an interposer and semiconductor dies; a packaging substrate attached to the assembly through solder material portions; and a lid structure attached to the packaging substrate. The lid structure includes:...