ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,808, issued on Jan. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Die and package structure" was invented by Wei-Chih Chen (Taipei, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Sih-Hao Liao (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die includes a substrate, a conductive pad, a connector a protection layer, and a passivation layer. The conductive pad is disposed over the substrate. The connector is disposed on the conductive pad. The connector comprises a seed layer and a conductive post on the seed layer. The protection layer laterally covers the connecto...