US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 20 for "Package structure with cavity substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,789, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with cavity substrate" was invented by Po-Hao Tsai (Zhongli, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan) and Mirng-Ji Lii (Sinpu Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a substrate including a cavity and a plurality of thermal vias connecting a bottom surface of the cavity to a bottom surface of the substrate. The package structure also includes an electronic device disposed in the cavity and thermally coupled to the plurality...