ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,725, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Package structure" was invented by Tung-Liang Shao (Hsinchu, Taiwan), Wen-Lin Shih (Taipei, Taiwan), Su-Chun Yang (Hsinchu County, Taiwan), Chih-Hang Tung (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a first interconnect structure formed over a first substrate. The package structure also includes a second interconnect structure formed below a second substrate. The package structure further includes a bonding structure between th...