US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 20 for "MIM capacitor in IC heterogenous integration" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,761, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"MIM capacitor in IC heterogenous integration" was invented by Tsung-Chieh Hsiao (Changhua County, Taiwan), Chung-Yun Wan (Changhua County, Taiwan), Liang-Wei Wang (Hsinchu, Taiwan) and Dian-Hau Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present disclosure pertains to a method. The method includes receiving a first circuit structure having semiconductor devices, an interconnect structure, first feedthrough vias, top metal lines, redistribution vias, and bond pads. The method includes dicing the first ...