US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 20 for "Method for manufacturing semiconductor structure and semiconductor structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,678, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor structure and semiconductor structure thereof" was invented by Yu-Chun Shen (Tainan, Taiwan), Chi-Chung Jen (Kaohsiung, Taiwan), Kai-Hung Hsiao (Kaohsiung, Taiwan), Szu-Hsien Lee (Kaohsiung, Taiwan) and Wen-Chih Chiang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a pillar structure and a spacer structure is provided. The pillar structure is disposed over a substrate, and comprises: a lower layer, disposed on the substrate; an upper layer, disposed ove...