US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 13 for "Thermally-aware semiconductor packages" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,578, issued on Jan. 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Thermally-aware semiconductor packages" was invented by Fong-Yuan Chang (Hsinchu County, Taiwan), Ching-Yi Lin (Zhubei, Taiwan), Po-Hsiang Huang (Tainan, Taiwan), Ho Che Yu (Zhubei, Taiwan) and Jyh Chwen Frank Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first substrate. The semiconductor device includes a plurality of metallization layers formed over the first substrate. The semiconductor device includes a plurality of via structures formed over the plurality of metallization layers. The ...