US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 13 for "System and method for monitoring chemical mechanical polishing" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,836, issued on Jan. 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"System and method for monitoring chemical mechanical polishing" was invented by Chih-Yu Wang (Taichung, Taiwan), Tien-Wen Wang (Hsinchu, Taiwan), In-Tsang Lin (Kaohsiung, Taiwan) and Hsin-Hui Chou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for chemical mechanical polishing of a wafer includes a process chamber and a rotatable platen disposed inside the process chamber. A polishing pad is disposed on the platen and a wafer carrier is disposed on the platen. A slurry supply port is configured to supply slurry on...