US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 13 for "Semiconductor devices with enhanced carrier mobility" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,039, issued on Jan. 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor devices with enhanced carrier mobility" was invented by Ming-Shuan Li (Hsinchu County, Taiwan), Wei-Yang Lee (Taipei, Taiwan) and Chia-Pin Lin (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method of forming the same are provided. In an embodiment, an exemplary semiconductor method includes forming a fin-shaped structure extending from a substrate, the fin-shaped structure includes a number of channel layers interleaved by a number of sacrificial layers, recessing a source/d...