US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 13 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,551, issued on Jan. 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing thereof" was invented by Chung-Chieh Yang (Zhubei, Taiwan) and Yung-Chow Peng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a capacitor having a first conductor plate, a second conductor plate, and a portion of a dielectric layer interposed therebetween. The semiconductor device includes a plurality of first contact structures in electrical contact with the first conductor plate. The semiconductor device includes a plurality of second contact struc...