US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 13 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,482, issued on Jan. 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing thereof" was invented by Shih-Yao Lin (New Taipei, Taiwan), Cheng-Tien Chu (Hsinchu, Taiwan), Chi-Wei Yang (Taoyuan, Taiwan), Hsiao Wen Lee (Hsinchu, Taiwan), Chih-Han Lin (Hsinchu, Taiwan) and Jr-Jung Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making a semiconductor device includes forming a first fin structure, a second fin structure, and a third fin structure over a substrate. The first through third fin structures all extend along a first lateral direction...