US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 13 for "Semiconductor devices and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,556, issued on Jan. 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacture" was invented by Yen-Kun Lai (New Taipei, Taiwan), Yi-Wen Wu (Xizhi, Taiwan), Kuo-Chin Chang (Chiayi, Taiwan), Po-Hao Tsai (Zhongli, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of manufacturing are provided, wherein a first passivation layer is deposited over a top redistribution structure; a second passivation layer is deposited over the first passivation layer; and a first opening is formed through the second pas...