ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,501, issued on Jan. 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Pavithra Sriram (Hsinchu, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan), Po-Yuan Teng (Hsinchu, Taiwan), Cheng-Chieh Wu (Taoyuan, Taiwan), Mao-Yen Chang (Kaohsiung, Taiwan), Yu-Chia Lai (Miaoli County, Taiwan), Shu-Rong Chun (Hsinchu County, Taiwan) and Hao-Yi Tsai (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first redistribution structure, a first semiconductor package, a second semiconductor package, an encapsulation layer, a first thermal interface material (TI...