US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 13 for "Protective ring structure for vacuum interface and method of using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,937, issued on Jan. 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Protective ring structure for vacuum interface and method of using the same" was invented by Ming-Hsun Tsai (Hsinchu, Taiwan), Yu-Fa Lo (Kaohsiung, Taiwan) and Shang-Chieh Chien (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An assembly for use with an extreme ultraviolet (EUV) chamber, along with methods of using such, are described. The assembly includes a ring structure. The ring structure includes an outer ring and an inner ring disposed radially inward of the outer ring. The assembly also includes a vacuum interface to...